HCK100系列
发布时间:2024/01/03
本机床适用于重型机器厂、鼓风机厂、重型电机厂、汽轮机厂、造船厂、造纸机械厂、轧辊厂对轴类零 件的圆柱表面、外曲线表面、锥面、螺纹及端面、切槽、切断等粗、精加工。机床CNC 可选用SIEMENS、FANUC、 广州数控、华中数控等品牌。
This machine is applicable for rough and finish machining the cylindrical surface,external curved surface,conical surface,thread and end surface,as well as grooving and cutting of the axle parts that used in heavy-duty machine factory,air-blower factory,heavy-duty electric motor factory,steam turbine factory,ship-building factory,paper machinery plant and roller factory.The CNC brand of SIEMENS,FANUC,GSK and HNC can be selected on this machine.
注:(1) 本公司保留修改技术参数的权利。
样本如与技术协议有出入,以技术协议为准。
二。技术参数
型号 参数 | Model Para meters | HCK100×L/10-D3 | HCK100×L/16-D3 | HCK100×L/20-D3 |
床身导轨形式 | Type of lathe bed guideway | 整体床身三导轨 Integrated three guideways on lathe bed | ||
最大回转直径 (mm) 床身上 刀架上 | Max.swing diameter(mm) On lathe bed On tool post | φ1000 φ800 | ||
最大工件长度L (mm) | Max.workpiece length L(mm) | 3000~8000 | ||
最大工件重量 (t) | Max.workpiece weight(t) | 10 | 16 | 20 |
加工直径范围 (mm) | Range of machining diameter(mm) | 0~φ800 | ||
主轴锥孔尺寸 (mm) | Dimension of spindle taper hole(mm) | φ106.375 1:4 | ||
花盘最大扭矩 (kN·m) | Max,faceplate torque (kN·m) | 12 | 16 | 16 |
单刀架切削力 (kN) | Cutting force of single tool post(kN) | 63 | ||
花盘直径 (mm) | Faceplate diameter (mm) | φ1000 | ||
主轴转速级数及范围 级数 范围(r/min) | Steps and range of spindle rotational speed Step Range(r/min) | 直流无级 DC stepless 2~400 | 直流无级 DC stepless 1.6~320 | 直流无级 DC stepless 1.6~320 |
刀架进给 (mm/min) 纵向 横向 | Tool post feed range (mm/min) Longitudinal Transverse | 1~600 1~400 | ||
刀架快速移动 (mm/min) 纵向 横向 | Tool post fast movement (mm/min) Longitudinal Transverse | 6000 2000 | 6000 4000 | 6000 4000 |
主电机功率 (kW) | Power of main motor (kW) | 49 | 49 | 55 |
如:砂带磨装置、排屑器装置、喷雾冷却装置、镗内孔装置等。 Note:the above data are for standard parameters,the different CNC system and special functional components shall be equipped according to the user requirements.For example,abrasive belt grinding device,chip conveyor device,spray cooling device and boring internal hole device,etc. | ||||